Reflow Soldering
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint. Heating may be accomplished by passing the assembly through a reflow oven or under an infrared lamp or by soldering individual joints with a hot air pencil.
Reflow soldering is the most common method of attaching surface mount components to a circuit board, although it can also be used for through-hole components by filling the holes with solder paste and inserting the component leads through the paste. Because wave soldering can be simpler and cheaper, reflow is not generally used on pure through-hole boards. When used on boards containing a mix of SMT and THT components, through-hole reflow allows the wave soldering step to be eliminated from the assembly process, potentially reducing assembly costs.
The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. In the conventional reflow soldering process, there are usually four stages, called “zones”, each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
SEHO reflow soldering systems stand for innovative technology, designed to increase your productivity.
Reflow Soldering
Showing all 4 results
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Reflow Soldering
Seho Goreflow Soldering Machine
With a heating zone length of 1850 mm (72.8″) or 2350 mm (92.5″) the convection reflow soldering systems GoReflow 1.8 and GoReflow 2.3 are ideally suited for small to medium-sized production series. The machines are not only featured with an outstanding attractive design, above all the systems convince with their well-engineered concept and excellent soldering results.
SKU: Goreflow -
Reflow Soldering
Seho MaxiReflow HP Soldering Machine
SEHO goes this innovative and new way with the MaxiReflow HP that ideally combines convection heat and a special hyper-pneumatic module, thus ensuring virtually void-free solder connections while using gas convection for even assembly heating.
SKU: MAXIREFLOW HP -
Reflow Soldering
Seho MaxiReflow Soldering Machine
The convection reflow soldering system MaxiReflow has set a milestone in soldering technology and won various technology awards. The reflow oven is equipped with a revolutionary, thermally invisible conveyor system and a new, high-functional process gas cleaning.
SKU: MAXIREFLOW -
Reflow Soldering
Seho PowerReflow-2 Soldering Machine
SEHO PowerReflow-2 Soldering Machine was developed for medium to large production series. The system excels by its highly efficient energy transfer and its modern design. With comparatively low investment costs and low operating expenses, PowerReflow-2 offers ideal value for money, thus ensuring high profitability in your surface mount production.
SKU: POWERREFLOW-2
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Reflow Soldering
Seho Goreflow Soldering Machine
With a heating zone length of 1850 mm (72.8″) or 2350 mm (92.5″) the convection reflow soldering systems GoReflow 1.8 and GoReflow 2.3 are ideally suited for small to medium-sized production series. The machines are not only featured with an outstanding attractive design, above all the systems convince with their well-engineered concept and excellent soldering results.
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Reflow Soldering
Seho MaxiReflow Soldering Machine
The convection reflow soldering system MaxiReflow has set a milestone in soldering technology and won various technology awards. The reflow oven is equipped with a revolutionary, thermally invisible conveyor system and a new, high-functional process gas cleaning.
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Reflow Soldering
Seho PowerReflow-2 Soldering Machine
SEHO PowerReflow-2 Soldering Machine was developed for medium to large production series. The system excels by its highly efficient energy transfer and its modern design. With comparatively low investment costs and low operating expenses, PowerReflow-2 offers ideal value for money, thus ensuring high profitability in your surface mount production.
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Reflow Soldering
Seho Goreflow Soldering Machine
With a heating zone length of 1850 mm (72.8″) or 2350 mm (92.5″) the convection reflow soldering systems GoReflow 1.8 and GoReflow 2.3 are ideally suited for small to medium-sized production series. The machines are not only featured with an outstanding attractive design, above all the systems convince with their well-engineered concept and excellent soldering results.
-
Reflow Soldering
Seho MaxiReflow Soldering Machine
The convection reflow soldering system MaxiReflow has set a milestone in soldering technology and won various technology awards. The reflow oven is equipped with a revolutionary, thermally invisible conveyor system and a new, high-functional process gas cleaning.
-
Reflow Soldering
Seho PowerReflow-2 Soldering Machine
SEHO PowerReflow-2 Soldering Machine was developed for medium to large production series. The system excels by its highly efficient energy transfer and its modern design. With comparatively low investment costs and low operating expenses, PowerReflow-2 offers ideal value for money, thus ensuring high profitability in your surface mount production.
