Reflow Ovens

Reflow Soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint. Heating may be accomplished by passing the assembly through a reflow oven or under an infrared lamp or by soldering individual joints with a hot air pencil.

The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. In the conventional reflow soldering process, there are usually four stages, called “zones”, each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.

We offer Reflow Ovens from the best three worldwide brands which any of them has specific characteristics:

Essemtec

Mechatronic Systems

Seho

  •  “The Lizard” for medium volume soldering 
  • Particular in zone regulation
  • Storing profiles
  • Extra high air circulating volume for complex PCB
  • Integrated microprocessor for profile control and storage.
  • 3-5 zone reflow
  • For solder paste with or without lead
  • Bench top and cabinet models
  • Small to medium volume soldering
  • Cost effective models.
  • High power heating element with force air heating method
  • Stores up any number of profiles
  • For single or double side board soldering
  • SEHO GoReflow: Ideally suited for small to medium sized volumes
  • SEHO PowerReflow: The flexible system for medium production series
  • SEHO MaxiReflowThe high end system for maximum demands
  • Innovative technology to increase profitability of production

Reflow Ovens Categories