Stannol Solder Paste SP2400 TSC105-89-3 500G


No Longer Manufactured

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Solder Paste SP2400
The solder paste SP2400 has been developed for the high volume, lead-free SMD electronics manufacturing. The solder paste is characterized by less voiding. The long open times and the high printability have a positive effect on the soldering result. With a special formula for excellent wetting, it meets the requirements for wetting on the surfaces which can be found today in every series manufacturing process. The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.


Solder Paste SP2400

Solder Paste SP2400


  • Less voiding
  • Reflow under air and nitrogen atmosphere possible
  • Long open times of the paste
  • No-Clean
  • Less residues, good electrical safety
  • Stable printing characteristics


The solder paste is available in the alloy TSC105 and TSC305. This solder paste is produced in grain size 3 (25-45 µm) and 4 (20-38µm). The solder paste is available in 500g jar.


The solder paste has been developed for stencil printing. The paste can be used in all common open and closed printing systems. The paste is particularly suitable to decrease voiding. Because of the excellent wetting on common surfaces it is suitable for soldering in an air or nitrogen atmosphere

SKU: 692410 Categories: , Tag: Brand:

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