KOKI Halogen Free Low Ag Solder Paste”Hybrid” High Reliability
S01XBIG58-M500-4 Sn 0.1Ag 0.7Cu 1.6Bi + Ni
Achieved joint reliability superior to SAC305
The only difference from SAC305 is “low cost”
A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement.
■ Alloy matrix
Maintains thermal-fatigue resistance for a long time
IMCs containing Ni (yellow points in the diagram on the right) finely disperse among Sn crystals and prevents growth of Sn crystals due to thermal shocks. Therefore, S1XBIG/S01XBIG makes a clear distinction from SAC305 also for its “long-lasting robustness” not just temporary withstandability.
■ Solder joint diagram (After 1500 cycles of -30 +/-80℃)
Achieved both low-Ag and halogen-free
KOKI strives to respond to customers’ requests for cost cutting and to become, as a company that sets a high value on environmental conservation, a good partner of all customers who are considerate to the environment. Therefore, all our low Ag products have halogen free versions in their line-up.
Product Performance Table
| Product Name | S01XBIG58-M500-4 | Product Category | Solder Paste | |
| Flux Type | ROL0 (IPC J-STD-004A) | Melting Point(℃) | 211-227 | |
| Particle Size（μm） | 20-38 | Viscosity（Pa.s） | 220 | |
| Flux Content(%) | 11.2 | Halide content(%) | 0 |
KOKI Halogen Free Low Ag Solder Paste”Hybrid” High Reliability
