Technical Data:
- Lead free
- yes
- Heating area
- 460 x 410 mm
- Heating system
- top and bottom – separated and selective control
- Clearance for assemblies
- max. 35 mm
- Heating controlling
- Free programmable control for temperature curve setting
- Heat distribution
- high power heating element with force air heating method
- Cooling
- Dual channel air circulation for fast cool down process – exhaust port will be automatically open
- Heating temperatures
- 30 – 300 °C
- Soldering process time
- ca. 4 – 5 min per cycle of 300×300 mm PCB
- Rated power
- max. 4800 W / typ. 2200 W
- Features
- cost effective soldering process
- stores up any number of profiles
- fully automatic, fully static ( non moving rail ) operation
- for single or double side board soldering
- large transparent glass window see trought the soldering process
- Power requirements
- 380 VAC / 50-60 Hz
- Dimension and wight
- 675 x 630 x 300mm / ca.55 kg
