Technical Data:
- Lead free
- yes
- Heating area
- max. 320 x 220 mm
- Heating system
- top und bottom – separated and selektive controled
- Clearance for assemblies
- max. 35 mm
- Heating controlling
- Free programmable for temperature curve setting
- Heat distribution
- high power heating element with force air heating method
- Cooling
- Dual channel air circulation for fast cool down process – exhaust port will be automatically open
- Heating temperatures
- 30 – 290 °C
- Soldering process time
- ca. 4 – 5 min per cycle of 300×200 mm PCB
- Rated power
- max. 3500 W / typ. 1000 W
- Features
- cost effective soldering process
- stores up any number of profiles
- fully automatic, fully static ( non moving rail ) operation
- for single or double side board soldering
- large transparent glass window see trought the soldering process
- Power requirements
- 210-230 VAC / 50-60Hz
- Dimension and wight
- 555 x 480 x 300mm / ca.30 kg
