Thermal Profiling Systems

Thermal Profiling Systems

Temperature and time are variables in PCB soldering that must be tightly controlled for a good outcome. It’s a balancing act, indeed. PCB assemblies have to be processed at a high enough temperature for a long enough period of time to form good solder joints, but overshooting the temperature or heating the assembly too quickly can damage components. Of course, insufficient heat also has detrimental results which can cause poor soldering and long-term reliability issues.
The only way to get time and temperature just right is to measure and analyze.