Stable printability and print shape:
Printing Adhesive JU-50P achieves a consistent stencil release property regardless of the pattern size and shape.
It also secures stable print shape during continuous use.
Product outline:
- Printing application adhesive to hold down surface mount devices prior to soldering
- Stable dispense shape during continuous use
- Fine pattern printing available
- Post curing adhesive ensures high electrical reliability
- Superior heat slump resistance allows it to retain its height during the curing process
Superior heat slump resistance:
Heat slump of JU-50P during continual printing and curing is suppressed, resulting in improved post-printing shape retention.
