JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits.
Therefore, contact with surface-mounted components of any shape is achieved, improving reliability of the wave soldering process.
Product outline:
- Dispense application adhesive to hold down surface mount devices prior
to soldering - Advanced storage stability
- Stable dispense shape during continuous use
- Fine pattern dispensing for components such as 0402(1005) chips
- Superior heat slump resistance allows it to retain its height during the
curing process
Resistant to heat slump:
JU-110-3 is resistant against heat slump, maintaining the height of deposits throughout the process.
The height of deposits and contact with surface-mounted components are maintained even during heating,
securely holding the components in place.
