KOKI Powerful Wetting General Purpose Solder Paste
S3X58-M500C-7Sn 3.0Ag 0.5Cu
Good and Consistent Wetting
Spreading to Oxidized Metal Surface.
Product Performance Table
Product Name | S3X58-M500C-7 | Product Category | Solder Paste | |
Composition | Sn 3.0Ag 0.5Cu | Melting Point(℃) | 217-219 | |
Particle Size(μm) | 20-38 | Viscosity(Pa.s) | 200 | |
Flux Content(%) | 11.8 | Halide content(%) | 0 | |
Flux Type | ROL0 (IPC J-STD-004) |