Energy-saving
By reducing the required reflow profile temperature, electricity consumption can be reduced by approximately 40% compared to SAC305.
Reduction of electricity consumption results in reduction in CO2 emissions, achieving both energy saving and environmental care
Reduces thermal damage to components and substrate
Energy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.
Reduces thermal damage to components and substrate
Energy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.
| Product Name | T4AB58-M742 / T4AB58-M742D | Product Category | Solder Paste | |
| Composition |
|
Melting Point(℃) | 138-140 | |
| Particle Size（μm） | 20-38 | Viscosity（Pa.s） | 190 | |
| Flux content(%) | 10 | Halid content (%) | 0 |
