Energy-saving
By reducing the required reflow profile temperature, electricity consumption can be reduced by approximately 40% compared to SAC305.
Reduction of electricity consumption results in reduction in CO2 emissions, achieving both energy saving and environmental care
![TB48_011](https://widaco.net/wp-content/uploads/2020/07/TB48_011.jpg)
Reduces thermal damage to components and substrate
Energy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.
![5](https://widaco.net/wp-content/uploads/2020/07/5-300x188.jpg)
Reduces thermal damage to components and substrate
Energy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.
![TB48_031](https://widaco.net/wp-content/uploads/2020/07/TB48_031-300x182.jpg)
Product Name | T4AB58-M742 / T4AB58-M742D | Product Category | Solder Paste | |
Composition |
|
Melting Point(℃) | 138-140 | |
Particle Size(μm) | 20-38 | Viscosity(Pa.s) | 190 | |
Flux content(%) | 10 | Halid content (%) | 0 |