KOKI Lead Free Solder Paste S3X58 (SAC305)


KOKI Powerful Wetting General Purpose Solder Paste

S3X58-M500C-7Sn 3.0Ag 0.5Cu

Good and Consistent Wetting
Spreading to Oxidized Metal Surface.

Activator Technique

After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.


Low Voiding Technique


Solder Spreading Property

After continual print, pause 45 min. or 60 min. and resume printing and observe print volume.

Test condition
・ Stencil : 200μm / 6.5mmφ aperture
・ Pre-conditioning : 150ºC for 16Hr
・ Heat source : Convection reflow
・ Reflow : Air

Product Performance Table

Product Name S3X58-M500C-7 Product Category Solder Paste
Composition Sn 3.0Ag 0.5Cu Melting Point(℃) 217-219
Particle Size(μm) 20-38 Viscosity(Pa.s) 200
Flux Content(%) 11.8 Halide content(%) 0
Flux Type ROL0 (IPC J-STD-004)
SKU: S3X58-M500C-7 Category: Tags: ,