KOKI Low Melting Point Lead-Free Solder Paste T4AB58-M742D


Reliable and workable in low temperature reflow

Energy-saving

By reducing the required reflow profile temperature, electricity consumption can be reduced by approximately 40% compared to SAC305.
Reduction of electricity consumption results in reduction in CO2 emissions, achieving both energy saving and environmental care

Reduces thermal damage to components and substrate

Energy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.

Reduces thermal damage to components and substrate

Energy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.

 Product Name T4AB58-M742 / T4AB58-M742D Product Category Solder Paste
Composition
Sn 57.6Bi 0.4Ag
Melting Point(℃) 138-140
Particle Size(μm) 20-38 Viscosity(Pa.s) 190
Flux content(%) 10 Halid content (%) 0

 

 

 

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SKU: T4AB58-M742D Category: