Reflow Oven

Reflow Oven RK 320

Reflow Oven RK320

cost effective soldering process
stores up to three profiles
fully automatic, fully static ( non moving rail ) operation
for single or double side board soldering
large transparent glass window see trought the soldering process with hight temperature build in 35 W light

Category Reflow Ovens Tags Mechatronic System, Reflow Oven, Reflow Oven RK 320

Description

Reflow Oven

Technical Data:

Lead free
yes

Heating area
max. 320 x 220 mm

Clearance for assemblies
max. 35 mm

Heating controlling
Programmable 20 zone control for temperature curve setting

Heat distribution
high power heating element with force air heating method

Cooling
Dual channel air circulation for fast cool down process

Heating temperatures
30 – 290 °C

Soldering process time
ca. 4 – 5 min per cycle of 300×200 mm PCB

Rated power
max. 3500 W / typ. 1000 W

Features
cost effective soldering process
stores up to three profiles
fully automatic, fully static ( non moving rail ) operation
for single or double side board soldering
large transparent glass window see trought the soldering process with hight temperature build in 35 W light

Power requirements
220 VAC / 50Hz

Dimension and wight
490 x 450 x 345mm / ca.30 kg