Relentless All-Terrain Dispenser
Introducing – The Tarantula – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
| Tarantula | ||
| Process | Maximum dispensing speed | Piezo Jet Valve: 145‘000 dots/h |
| Pneumatic Jet Valve: 77‘000 Dots/h | ||
| Time/Pressure Valve: 26‘000 Dots/h | ||
| Archimedean Screw Valve: 22‘000 Dots/h | ||
| Dispensing mode | Dot, line, curve, interpolated 3D contour | |
| Accuracy | Placement XY dots | ±40 μm (3σ) |
| Positioning Z axis | ±20 μm (3σ) | |
| PCB | PCB dimensions | 560 x 610 mm (22 x 24“) |
| Dimensions | Machine footprint | 1’557 x 1’357 mm (61 x 53“) |
MULTITALENT SOFTWARE
AT YOUR FINGERTIPS
State of the art, full graphics, 21.5”, 16:9 HD wide touch screen, fingertip operation, universal CAD conversion,
zoom at camera windows, all-in-one job planning, setup optimisation, stock management, ERP/MES connection,
data analysis, line management and more.
VALVES AND PUMPS
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| Time-Pressure | Volume | Screw | Piezo Jet | Pneumatic Jet |
| Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill |
Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste |
Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill |
SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Solder Paste |
Solder Paste, Dam and Fill, SMD-Adhesives |
| High Viscosity | Low – High Viscosity | High Viscosity | Low – High Viscosity | Low – High Viscosity |
| Up to 28.000 dots/h | Up to 28.000 dots/h | Up to 20.000 dots/h | Up to 15.000 dots/h | Up to 80.000 dots/h |
