FOX Smart-Sized Modular Pick and Place Machine

Download Brochure1
Download Brochure2
Download Specification

Modular Pick and Place
Introducing – The Fox Pack – State of the art technology. Expandable in any direction. The Fox can drive up to 200 feeder, illustrating its dedication to high-mix production. Due to its small footprint and reasonable weight, the machine is ideal for use in limited space production areas even those located on upper floors.

Add to quote

Modular Pick and Place

Introducing – The Fox Pack – State of the art technology. Modular Pick and Place expandable in any direction. The Fox can drive up to 200 feeder, illustrating its dedication to high-mix production. Due to its small footprint and reasonable weight, the machine is ideal for use in limited space production areas even those located on upper floors.

Modular Pick and Place
Modular Pick and Place
Modular Pick and Place
Modular Pick and Place
Modular Pick and Place
Modular Pick and Place
Modular Pick and Place
Fox4 Fox2 Fox1
Productivity Optimum placement speed 18800 cph (4-axes) 12000 cph (2-axes) 7000 cph (1-axis)
Optimum – New Fox Ultra 31000 cph (4-axes) 18000 cph (2-axes) 9500 cph (1-axis)
Solder Paste Jetting
Shockwave Jet Valve
Jet-on-the-Fly
Max Frequency: 780000 dots/h
BGA Pattern Speed: 480000 dots/h
Average board speed: 280000 dots/h
Feeder Feeder capacity 8 mm Tape 200 (140 inline) 180 (120 inline) 180 (120 inline)
Components Component size range 008004 (imp.) – 109 x 87 mm (Note specs for details)
Accuracy Placement accuracy (x, y) Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ)
PCB Max. PCB dimensions 406 x 305 mm (16 x 12″)
Dimensions Machine footprint 880 x 1090 mm (34.7 x 43″)

MULTITALENT SOFTWARE 
AT YOUR FINGERTIPS

State of the art, full graphics,  21.5”, 16:9 HD wide touch screen, fingertip operation, universal CAD conversion,
zoom at camera windows, all-in-one job planning, setup optimisation, stock management, ERP/MES connection,
data analysis, line management and more.

Multifunctional Pick & Place

VALVES AND PUMPS

Piezo Jet Shockwave Jet Volume Screw Time-Pressure
SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Dielectric Ink Solder Paste, Liquid Metal Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill
Low – High Viscosity High Viscosity Low – High Viscosity High Viscosity High Viscosity
Max Frequency: 2000000 dots/h
BGA Jet-on-the-Fly: 780000 dots/h
BGA Stop & Jet: 177000 dots/h
Max Frequency: 780000 dots/h
BGA Jet-on-the-Fly: 480000 dots/h
Average Speed: 280000 dots/h
26000 dots/h (BGA Pattern*) 30000 dots/h (BGA Pattern*) 38000 dots/h (BGA Pattern*)

Video

Scroll to Top