Modular Pick and Place
Introducing – The Fox Pack – State of the art technology. Modular Pick and Place expandable in any direction. The Fox can drive up to 200 feeder, illustrating its dedication to high-mix production. Due to its small footprint and reasonable weight, the machine is ideal for use in limited space production areas even those located on upper floors.
| Fox | Fox2 | Fox4 | ||
| Productivity | Optimum placement speed | 7’000 cph (1-axis) | 12’000 cph (2-axes) | 24’600 cph (2x 4-axes) |
| Optimum jetting speed | – | 150‘000 Dots/h | – | |
| Feeder | Feeder Capacity 8 mm Tape | 180 (120 inline) | 180 (120 inline) | 200 (140 inline) |
| Components | Component Size Range | 01005 – 33 x 80 mm | (80 x 80 mm optional) | |
| Accuracy | Placement accuracy (x, y) | 50 μm @ 3σ | ||
| PCB | Max. PCB dimensions | 406 x 305 mm (16 x 12“) | ||
| Dimensions | Machine footprint | 880 x 1090 mm (34.7 x 43“) |
MULTITALENT SOFTWARE
AT YOUR FINGERTIPS
State of the art, full graphics, 21.5”, 16:9 HD wide touch screen, fingertip operation, universal CAD conversion,
zoom at camera windows, all-in-one job planning, setup optimisation, stock management, ERP/MES connection,
data analysis, line management and more.
VALVES AND PUMPS
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| Time-Pressure | Volume | Screw | Piezo Jet | Pneumatic Jet |
| Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill |
Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste |
Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill |
SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Solder Paste |
Solder Paste, Dam and Fill, SMD-Adhesives |
| High Viscosity | Low – High Viscosity | High Viscosity | Low – High Viscosity | Low – High Viscosity |
| Up to 28.000 dots/h | Up to 28.000 dots/h | Up to 20.000 dots/h | Up to 15.000 dots/h | Up to 80.000 dots/h |
