Relentless strong pick and place & dispensing
Introducing – The Puma – State of the art technology. Expandable in any direction. Same as in nature our Puma is common modular and adaptive in all kinds of environment . With different modules the systems grow synchronously with the customer’s requirements for performance and processes. Puma is world`s best highspeed Pick-and-Place solution which can also be used in ultraflexible, rapid prototyping development.
| Puma | Puma2 | Puma4 | ||
| Productivity | Optimum placement speed | 6’700 cph (1-axis) | 11’200 cph (2-axes) | 18’100 cph (4-axes) |
| Optimum jetting speed | 145‘000 Dots/h | |||
| Feeder | Feeder capacity 8 mm Tape | 260 (140 inline) | 260 (140 inline) | 280 (160 inline) |
| Components | Component size range | 01005 – 33 x 80 mm | (80 x 80 mm optional) | |
| Accuracy | Placement accuracy (x, y) | 50 μm @ 3σ | ||
| PCB | Max. PCB dimensions | 560 x 610 mm (22 x 24“) | optional 1’800 x 610 mm (71 x 24“) | |
| Dimensions | Machine footprint | 1’557 x 1’357 mm (61 x 53“) |
MULTITALENT SOFTWARE
AT YOUR FINGERTIPS
State of the art, full graphics, 21.5”, 16:9 HD wide touch screen, Windows 10 – 64 bit, fingertip operation,
universal CAD conversion, zoom at camera windows, all-in-one job planning, setup optimisation,
stock management, ERP/MES connection, data analysis, line management and more.
VALVES AND PUMPS
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| Time-Pressure | Volume | Screw | Piezo Jet | Pneumatic Jet |
| Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill |
Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste |
Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill |
SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Solder Paste |
Solder Paste, Dam and Fill, SMD-Adhesives |
| High Viscosity | Low – High Viscosity | High Viscosity | Low – High Viscosity | Low – High Viscosity |
| Up to 28.000 dots/h | Up to 28.000 dots/h | Up to 20.000 dots/h | Up to 15.000 dots/h | Up to 80.000 dots/h |
