Relentless Multifunctional Pick and Place
Introducing – The Paraquda – 3 in 1 multifunctional production center. The Paraquda SMD pick-and-place system is designed for low/mid volume or NPI (new product introduction) high-mix productions. The Paraquda combines three different production steps within one machine platform (solder paste jetting and/or glue jetting and SMD assembly).
| Paraquda2 | Prarquda4 | Para-Doble | ||
| Productivity | Optimum placement speed | 8’200 cph (2-axis) | 12’300 cph (4-axes) | 24’600 cph (2x 4-axes) |
| Optimum jetting speed | 100‘000 Dots/h | |||
| Feeder | Feeder Capacity 8 mm Tape | 240 (200 inline) | 240 (200 inline) | 400 inline |
| Components | Component Size Range | 01005 up to 40×40 mm | (80 x 70 mm optional) | |
| Accuracy | Placement accuracy (x, y) | 51 μm @ 3σ | ||
| PCB | Max. PCB dimensions | 600 x 430 mm (23.6 x 16.9 ” ) | ||
| Dimensions | Machine footprint | 1300 x 1450 mm (51.2 x 57.1 ” ) | 1300 x 1450 mm (51.2 x 57.1 ” ) | 3040 x 1450 mm (118.1 x 57.1“) |
MULTITALENT SOFTWARE
AT YOUR FINGERTIPS
State of the art, full graphics, 21.5”, 16:9 HD wide touch screen, fingertip operation, universal CAD conversion,
zoom at camera windows, all-in-one job planning, setup optimisation, stock management, ERP/MES connection,
data analysis, line management and more.
VALVES AND PUMPS
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| Time-Pressure | Volume | Screw | Piezo Jet | Pneumatic Jet |
| Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill |
Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste |
Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill |
SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Solder Paste |
Solder Paste, Dam and Fill, SMD-Adhesives |
| High Viscosity | Low – High Viscosity | High Viscosity | Low – High Viscosity | Low – High Viscosity |
| Up to 28.000 dots/h | Up to 28.000 dots/h | Up to 20.000 dots/h | Up to 15.000 dots/h | Up to 80.000 dots/h |
